Wayne Lee
Field Application Engineering, Director at SPIL
Email:
w****@spilca.com
Phone Number: (***)-***-****
Package Applications Engineering: NPI support & development for flip chip FCCSP/FCBGA, substrate & leadframe packaging. Includes design, support, and qualification activity.Product Engine...
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SPIL
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Industry Semiconductors
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Website spil.com.tw
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HQ Phone +88**********
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Description
Established in May 1984, Siliconware Precision Industries Co., Ltd. has become one of the leading providers of comprehensive semiconductor assembly and test services. SPIL posted annual sales...Read More
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Employees 10001+
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Revenue 50 Million to 100 Million
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Frequently Asked Questions Regarding Wayne Lee
Answer: Wayne Lee works for SPIL as Field Application Engineering, Director
Answer: Wayne Lee’s role in SPIL is Field Application Engineering, Director
Answer: Wayne Lee's email address is w***@gmail.com
Answer: Wayne Lee's business email address is w****@spilca.com
Answer: Wayne Lee’s direct phone number is (***)-***-****
Answer: Wayne Lee works in the industry of: Semiconductors
Answer: Wayne Lee is the current Field Application Engineering, Director at SPIL.... Read More
Answer: SPIL's Field Application Engineering, Director is Wayne Lee
Answer: Wayne Lee contact details:
- Phone number : (***)-***-****
- Email : w****@spilca.com
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